Comparison Between Multilayer Ceramic and Organic Package Substrates Based Upon Signal and Power Integrity

摘要

Comparisons between organic and ceramicpackaging is a difficult task given the considerablenumber of differences in material properties andpotential tradeoffs between cost, electricalperformance, thermal performance, andenvironmental factors. This paper presents a powerand signal integrity comparison between a selectset of multilayer organic technologies (HDBU andCPCore) and multilayer ceramic technologies(HTCC and LTCC). The geometry and materialproperty impact on electrical performance for theflip-chip first level interconnect are qualitativelydiscussed and compared. The broadband frequencyperformance for the ball grid array (BGA) secondlevelinterconnect to a PWB is simulated andcharacterized to 40 GHz for a differential pairusing full-wave simulation. The impedance of thepower distribution network (PDN) for a ceramicpackage is characterized by measurement tocorrelate with full-wave simulation to thensubsequently compare with an organic substratePDN.