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Influence of Process Parameter and Magnetic Field Strength on DC Magnetron Sputtered ZnO:Al Films From Ceramic Targets

机译:工艺参数和磁场强度对陶瓷靶直流磁控溅射ZnO:Al薄膜的影响

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With the demand of a low cost and high quality TCO layer in thin film solar cell applications the need for a production process of ZnO:Al films suited for large area coatings in industry became apparent. Throughout the last years strong efforts have been made to use Al-doped ZnO films on glass as substrates for amorphous or amorphous/microcrystalline silicon solar cells. The material promises better performance at low cost especially because ZnO:Al can be roughened in order to enhance the light scattering into the cell. With the rise of production capacities first sputtering coaters for large area deposition of ZnO:Al are now being set up. Nowadays cost efficient, sintered ceramic ZnO:Al_2O_3 targets with high conductivity can be sputtered by using DC power. At Fraunhofer 1ST ceramic ZnO:Al_2O_3 (1 wt.%) targets were dc sputtered using a screening experiment design, which covered a wide interval of the main process parameters like total pressure, sputtering power and oxygen partial pressure, while substrate temperature was held constant at 300 °C. In this experiment a big influence on the target erosion was shown. During sputtering from a ceramic target, the film is damaged perpendicular to the erosion area by high energetic oxygen ion bombardment. The ions receive their energy from the potential difference between cathode and floating substrate. Their impact leads to a higher resistivity, lower mobility and a higher etching rate of the deposited layer in diluted hydrochloric acid. This counteracts the necessary properties of a TCO as front contact in a-Si/μc-Si solar cells. In order to understand and minimize these problems static imprints with a standard and a strong magnet were performed additionally. A new plane ZnO: Al_2O_3 target was used. Comparing the position-dependent properties of the imprints, their height profiles remained similar but a huge impact on resistivity was observed depending on the target state, namely the race track depth. Options to diminish the damaging effect of oxygen were examined, in particular the use of stronger magnets for magnetron sputtering to reduce the applied target voltage. The observed film damage increases with higher target voltage, therefore both are reduced by applying a higher magnetic field. The results show a clear reduction of target voltage by 40 V by applying the same power using a stronger magnetron. Also less damage opposite the race tracks was observed. Resistivity is lowered by a factor of 1.5 which yields better properties of ZnO: Al as front contact of thin film solar cells. Also the crystal structure and etching behavior changed positively.
机译:随着在薄膜太阳能电池应用中对低成本和高质量TCO层的需求,对适用于工业中大面积涂层的ZnO:Al膜的生产工艺的需求变得显而易见。在过去的几年中,人们一直在努力使用玻璃上的Al掺杂ZnO膜作为非晶或非晶/微晶硅太阳能电池的衬底。该材料有望以低成本提供更好的性能,特别是因为可以使ZnO:Al粗糙化,以增强进入电池的光散射。随着生产能力的提高,现在正在建立首个用于大面积沉积ZnO:Al的溅射镀膜机。如今,具有成本效益的高导电率烧结陶瓷ZnO:Al_2O_3靶可以通过使用直流电源进行溅射。在弗劳恩霍夫1ST陶瓷ZnO:Al_2O_3(1 wt。%)靶上使用筛选实验设计进行了直流溅射,该设计覆盖了主要工艺参数(如总压力,溅射功率和氧分压)的较宽范围,同时衬底温度保持恒定在300°C下。在该实验中,显示了对目标侵蚀的很大影响。在从陶瓷靶溅射时,垂直于腐蚀区域的膜会受到高能氧离子轰击的破坏。离子从阴极和浮动衬底之间的电势差接收能量。它们的影响导致沉积的层在稀盐酸中具有更高的电阻率,更低的迁移率和更高的蚀刻速率。这抵消了a-Si /μc-Si太阳能电池中作为正面触点的TCO的必要特性。为了理解和最小化这些问题,还额外进行了带有标准件和强磁体的静态压印。使用了新的平面ZnO:Al_2O_3靶。比较压印的位置相关特性,它们的高度轮廓保持相似,但是根据目标状态,即赛道深度,观察到了对电阻率的巨大影响。研究了减少氧气破坏作用的方法,特别是在磁控管溅射中使用更强的磁体来降低施加的目标电压。观察到的膜损伤随着较高的目标电压而增加,因此通过施加较高的磁场两者都可以减少膜损伤。结果表明,通过使用更强的磁控管施加相同的功率,可以将目标电压明显降低40V。在赛道对面的损坏也较少。电阻率降低了1.5倍,可以使ZnO:Al作为薄膜太阳能电池的正面触点具有更好的性能。晶体结构和蚀刻行为也发生了积极的变化。

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