Impregnation of Metal Complex into Epoxy Insulation Materials Using Supercritical Carbon Dioxide and Its Application for Copper Plating

摘要

Metal plating of epoxy polymer has been widely applied for industrial products for a long time, especially in the field of Printed Circuit Boards (PCB's). This technique is one of the most important technologies of electronics devices with high reliability and guaranteed quality. The authors are developing a new concept of PCB's for next decade generations to improved the techniques of which including more fine line circuitries, higher densities and narrower spaced conductor lines. An essential part of subject for this technology is to improve the weak copper adhesion peel strength on epoxy insulation materials. To obtain the good adhesion property of copper plating, it is now widely used the Pd Colloid Solution method. In order to further improve more excellent adhesion for next decade generation PCB's, we are investigating Super Critical Fluid (SCF) method. In this paper, an attempt has been made to impregnate some metal complexes into epoxy resin and then decomposed the complexes to produce free metal in the resin by reduction . Using the deposited metal is efficient electro-less Cu plating can be achieved. We will discuss the selection of the metal complexes and impregnation conditions on the complexes as well as peel strength of the plating.