3D Interconnection Technologies for Electronic Products:A Perspective View of Electronic Interconnection Technologies from Chip to System

摘要

3D is the shorthand term for the three dimensions of Cartesian coordinate space X, Y and Z. With that definition in mind, one will find with little or no stretching of the imagination, that the first electrical interconnections, performed using discrete wires were unquestionably 3D. If one doubts it they can look at almost any electrical product from the time of the 19th century telegraph onward. 3D interconnections are found virtually everywhere. It is really 2D that is more illusive if one thinks about it. Even so, 3D interconnection solutions and options have dominated the electronics manufacturing industry's attention over the last few years and interest in the topic has been accelerating. The reasons for this interest are manifold but the root cause is that the third dimension provides the ability to extend the pursuit of ever greater density when the acknowledged physics based limits that will ultimately spell the end of Moore's Law kick in. In order to keep delivering the promise of better cost/performance metrics for each new generation of electronics, interconnection technologies which take advantage of the third dimension will play an increasing important role in the future. In fact electronic interconnection technologies will undoubtedly pace price and performance improvements for most if not all future electronic products and 3D interconnections will play a pivotal role. This paper discusses 3D solutions which have been used from past to present from chip to system and will included a glimpse of what might be ahead.