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The Matrix Cracking Stress and Residual Thermal Stress of 2D SiC/SiC Composite Fabricated by PIP Process

机译:PIP工艺制造2D SiC / SiC复合材料的基质裂化应力和残余热应力

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A two dimensional silicon carbide fiber reinforced SiC matrix (2D SiC/SiC) composite was fabricated by precursor infiltration pyrolysis (PIP) process used a liquid SiC ceramic precursor. Two key properties including matrix cracking stress and residual thermal stress were investigated for this PIP 2D SiC/SiC composite. Three methods were applied to determine the matrix cracking stress in order to obtained a trusted value, and the value of matrix cracking stress for SiC/SiC composite was 75 ± 4 MPa. The residual thermal stress of the composites was calculated by linear regression line according to the loading-unloading-reloading stress-strain curve of the 2D SiC/SiC composite, and the result showed that the value of residual thermal stress of SiC matrix in composite was 20MPa, which means the PIP SiC matrix in the 2D SiC/SiC composite was under the compressive stress when the composite cooling down from the fabrication temperature to the room temperature.
机译:通过前体浸润热解(PIP)工艺制造了二维碳化硅纤维增强SiC基质(2D SiC / SiC)复合材料使用液体SiC陶瓷前体。研究了包括基质开裂应力和残余热应力的两个关键特性,用于该PIP 2D SiC / SiC复合材料。施加三种方法以确定基质裂化应力以获得可信值,SiC / SiC复合材料的基质裂化应力的值为75±4MPa。通过根据2D SiC / SiC复合材料的负载卸载重载的应力 - 应变曲线通过线性回归管线计算复合材料的残余热应力,结果表明,复合材料中SiC基质的残余热应力值是20MPa,这意味着当复合材料从制造温度降至室温时,2D SiC / SiC复合材料中的PIP SiC基质在压缩应力下。

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