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Residual stress free joined SiC ceramics and the processing method of the same

机译:无残余应力的SiC连接陶瓷及其加工方法

摘要

The present invention relates to a silicon carbide bonded body and a method of manufacturing the same, and more particularly, to a method of manufacturing a silicon carbide bonded body, comprising the steps of: sintering a silicon carbide substrate constituting a bonded body; Preparing a silicon carbide preform by interposing an un-sintered silicon carbide bonding agent having the same composition as the silicon carbide substrate between at least two substrates selected from the sintered silicon carbide substrates; And a step of heat-treating the silicon carbide pre-bonded body to produce a silicon carbide bonded body, and a method of manufacturing the silicon carbide bonded body. INDUSTRIAL APPLICABILITY According to the present invention as described above, it is possible to produce a bonded body having no residual stress by using a bonding agent conforming to the composition of the silicon carbide base material. Therefore, the carbonaceous base material having high strength in the range of 65 to 190% Silicon bond can be manufactured.
机译:碳化硅接合体及其制造方法技术领域本发明涉及一种碳化硅接合体及其制造方法,更具体地,涉及一种碳化硅接合体的制造方法,其包括以下步骤:烧结构成接合体的碳化硅衬底;通过在选自烧结碳化硅衬底的至少两个衬底之间插入具有与碳化硅衬底相同的成分的未烧结碳化硅粘合剂来制备碳化硅预成型体;以及热处理碳化硅预结合体以制备碳化硅结合体的步骤,以及制造碳化硅结合体的方法。工业上的可利用性如上所述,根据本发明,通过使用与碳化硅母材的组成一致的粘接剂,可以制造没有残留应力的粘接体。因此,可以制造具有在65%至190%的硅键范围内的高强度的碳质基材。

著录项

  • 公开/公告号KR101960264B1

    专利类型

  • 公开/公告日2019-03-20

    原文格式PDF

  • 申请/专利权人 서울시립대학교 산학협력단;

    申请/专利号KR20170030548

  • 发明设计人 김영욱;장승훈;

    申请日2017-03-10

  • 分类号C04B35/565;C04B35/626;C04B35/63;C04B35/645;

  • 国家 KR

  • 入库时间 2022-08-21 11:48:55

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