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A comprehensive study of degradation behavior of select transistors in the Charge Trap Flash memories

机译:对电荷陷阱闪存中所选晶体管的退化行为的全面研究

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The local electron trapping in the select transistors used in the Charge Trap Flash (CTF) NAND was analyzed in depth for the first time in terms of operation conditions and gate spacer process. In this work, we examined the mechanism of swing degradation in the select transistors with TANOS (TaN-Al2O3-Si3N4-SiO2-Si) structure due to repetitive program/erase [P/E] operation. The swing degradation can be explained by the local electron trapping induced from electric field between select transistors and neighboring transistors. The local electron trapping in select transistors are well correlated to the saturation of threshold voltage in the erased cells. The erase Vth saturation appears to be caused by unfavorable backward tunneling of electrons from gate to the trap layer. The degradation in the select transistor is perfectly solved by decreasing the electric field during erase operation and keeping an appropriate distance between select transistors and neighboring transistors.
机译:根据操作条件和栅极隔离层工艺,首次对电荷陷阱闪存(CTF)NAND中使用的选择晶体管中的局部电子陷阱进行了深度分析。在这项工作中,我们研究了使用TANOS(TaN-Al 2 O 3 -Si 3 N < inf> 4 -SiO 2 -Si)结构是由于重复的编程/擦除[P / E]操作所致。可以通过选择晶体管和相邻晶体管之间的电场引起的局部电子俘获来解释摆幅下降。选择晶体管中的局部电子俘获与所擦除的单元中的阈值电压的饱和度良好相关。擦除Vth饱和似乎是由于电子从栅极向陷阱层的反向向隧穿不利所引起的。通过减小擦除操作期间的电场并在选择晶体管和相邻晶体管之间保持适当的距离,可以完美地解决选择晶体管的劣化问题。

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