首页> 外文会议>Proceedings of the 36th European Solid-State Device Research Conference (ESSDERC 2006) >Impact of Random Dopant Fluctuation on Bulk CMOS 6-T SRAM Scaling
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Impact of Random Dopant Fluctuation on Bulk CMOS 6-T SRAM Scaling

机译:随机掺杂波动对CMOS 6-T SRAM缩放的影响

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Based on the statistical 3D device simulation of well scaled 25, 18 and 13nm physical gate length bulk MOSFETs, the impact of Random Dopant Fluctuation on 6-T SRAM is studied in detail. The bias control approach is introduced to improve the scalability of bulk CMOS SRAM. Simulation results indicate that at 13nm physical gate length, bulk CMOS SRAM will face fundamental challenges arising from intrinsic parameter fluctuation, and a replacement by Ultra Thin Body SOI CMOS may be necessary at this point.
机译:基于按比例缩放的25、18和13nm物理栅极长度体MOSFET的统计3D器件仿真,详细研究了随机掺杂波动对6-T SRAM的影响。引入了偏置控制方法以改善大容量CMOS SRAM的可扩展性。仿真结果表明,在物理长度为13nm的情况下,体CMOS SRAM将面临因固有参数波动而引起的根本挑战,此时可能需要用超薄SOI CMOS替代。

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