A STUDY ON KINEMATIC TRAJECTORY IN WAFER ROTATIONGRINDING

摘要

This paper introduces the principle and characteristic of wafer rotation grinding process. By analyzingrelative motion between the grinding wheel and the wafer, a kinematics model of the wafer rotation grinding isdeveloped in which the active contacting area and two different grinding modes, the down grinding and the up grinding,are considered. The length of trajectory and number of grinding marks are deduced. The relationship between grindingsurface quality and the density of grinding marks is theoretically analyzed. The cutting trajectories of grits on the siliconwafer are predicted by computer simulations based on mathematical modeling. The grinding trajectory curves can beoptimized by changing grinding process parameters in a cost-effective way. The trajectories of the grinding markspredicted by the model and experimental results match each other very well. The model provides theory basis toimprove the surface quality and select the proper parameters of grinding process.