AN INVESTIGATION ON COPPER CONDUCTIVE PASTE FOR HDIIVH SUBSTRATES

摘要

The physical, electrical and thermal properties of copper conductive paste for High Density Interconnected Inner Via Hole (HDIIVH) substrates were investigated. The copper conductive paste was composed by epoxy resin, curing agent, accelerator, copper powder, epoxy novolac and dilute for design the physical, electrical and thermal properties. By changing the contents of the ingredients, the fallowings were investigated : (1) the physical properties such as viscosity and moisture absorption rate, (2) the electrical property such as volume resistivity and (3) thermal properties such as weight loss for uncured samples and coefficient of thermal expansion (CTE), glass transition temperature (Tg), and modulus for cured samples. In this study, Brookfield Viscometer was used to determine the viscosity. Weight gain was measured from electrical balance for determining moisture absorbed from humidity chamber at 60°C/80% RH, the volume resistivity was measured by four-points probe. The modulus and CTE were studied by Dynamic Mechanical Analysis (DMA) and Thermal Mechanical Analysis (TMA). The weight loss of copper conductive paste during curing was determined by Thermogravimetric Analysis (TGA). The curing profiles for copper conductive paste were interpreted by Differential Scanning Calorimetry (DSC). The conductive model for the copper conductive paste was monitored by Optical Microscopy (OM) and Scanning Electron Microscopy (SEM).