首页> 外国专利> Being production manner of the silver coat copper powder for the print patchboard null conductive paste which uses the conductive paste, and its conductive paste which use the silver coat copper powder and that silver coat copper powder which are obtained

Being production manner of the silver coat copper powder for the print patchboard null conductive paste which uses the conductive paste, and its conductive paste which use the silver coat copper powder and that silver coat copper powder which are obtained

机译:作为使用该导电糊剂的印刷配线板用零导电糊剂的银包覆铜粉的制造方式,使用得到的银包覆铜粉和该银包覆铜粉的导电糊。

摘要

PROBLEM TO BE SOLVED: To provide a producing method for silver coated copper powder equipped with an alloy layer of silver and copper which realizes low resistance as much as that of silver coated copper powder and moreover makes paste viscosity lower when being fabricated into a conductive paste.;SOLUTION: This producing method for silver coated copper powder equipped with the alloy layer of silver and copper comprises a silver coating process of preparing silver coated copper powder by forming a silver layer on the surface of copper powder and a heating process of heating the silver coated copper powder in a wet reducing environment and performing strain relieving annealing of silver layer and copper powder.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种具有银和铜的合金层的涂银铜粉的制造方法,该方法实现了与涂银铜粉一样低的电阻,并且在制成导电浆料时降低了浆料的粘度解决方案:该具有银和铜的合金层的镀银铜粉的生产方法包括通过在铜粉表面形成银层来制备镀银铜粉的镀银工艺,以及加热铜粉的工艺。镀银铜粉在湿还原环境中进行银层和铜粉的应变消除退火。;版权所有:(C)2003,JPO

著录项

  • 公开/公告号JP4261786B2

    专利类型

  • 公开/公告日2009-04-30

    原文格式PDF

  • 申请/专利权人 三井金属鉱業株式会社;

    申请/专利号JP20010302408

  • 发明设计人 上住 義明;坂上 貴彦;

    申请日2001-09-28

  • 分类号B22F1/02;B23K35/22;C22C1/00;C22C1/04;C22C9/00;H01B1/00;H01B1/22;H01B13/00;H05K1/09;

  • 国家 JP

  • 入库时间 2022-08-21 19:37:34

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