首页> 外国专利> METHOD FOR MANUFACTURING SILVER-COATED COPPER POWDER, SILVER-COATED COPPER POWDER OBTAINED BY THE MANUFACTURING METHOD, CONDUCTIVE PASTE USING THE SILVER- COATED COPPER POWDER, AND PRINTED WIRING BOARD USING THE CONDUCTIVE PASTE

METHOD FOR MANUFACTURING SILVER-COATED COPPER POWDER, SILVER-COATED COPPER POWDER OBTAINED BY THE MANUFACTURING METHOD, CONDUCTIVE PASTE USING THE SILVER- COATED COPPER POWDER, AND PRINTED WIRING BOARD USING THE CONDUCTIVE PASTE

机译:制造银包铜粉的方法,由该制造方法获得的银包铜粉,使用银包铜粉的导电膏,以及使用导电膏的印刷线路板

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing silver-coated copper powder by which paste viscosity can be reduced when the copper powder is processed into a conductive paste, a silver-coated copper powder, and a conductive paste, etc.;SOLUTION: The method is a method for manufacturing the silver-coated copper powder having a silver layer on the surface, and, e.g. a method for manufacturing the silver-coated copper powder having the following steps is adopted: a silver coating step for forming the silver layer on the surface of the particles of the copper powder; and a silver-layer-smoothing step for smoothing the surface of the silver layer on the silver-coated copper powder. The resultant silver-coated copper powder has quality characteristics which cannot be seen in the conventional silver-coated copper powder, and the conductive paste manufactured by using this silver-coated copper powder has low paste viscosity.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种制造涂银铜粉的方法,通过该方法,当将铜粉加工成导电浆料,涂银铜粉和导电浆料等时,可以降低浆料的粘度;解决方案:该方法是用于制造在表面上具有银层的镀银铜粉的方法,例如采用具有以下步骤的覆银铜粉的制造方法:在覆铜粉的粒子表面形成银层的覆银步骤。银层平滑步骤,用于使涂银铜粉上的银层表面平滑。所得的涂银铜粉具有常规涂银铜粉所不具备的质量特性,并且使用该涂银铜粉制造的导电浆料的糊剂粘度低。;版权所有:(C)2003,JPO

著录项

  • 公开/公告号JP2002332501A

    专利类型

  • 公开/公告日2002-11-22

    原文格式PDF

  • 申请/专利权人 MITSUI MINING & SMELTING CO LTD;

    申请/专利号JP20010142218

  • 发明设计人 SAKAGAMI TAKAHIKO;UWAZUMI YOSHIAKI;

    申请日2001-05-11

  • 分类号B22F1/02;B22F1/00;H01B1/00;H01B1/22;H01B13/00;H05K3/12;

  • 国家 JP

  • 入库时间 2022-08-22 00:15:32

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