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Manufacturing of Conductive Wear-Resistant Nanoreinforced Cu-Ti Alloys Using Partially Oxidized Electrolytic Copper Powder

机译:使用部分氧化电解铜粉制造导电耐磨的纳米筋Cu-Ti合金

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摘要

Reactive powder composites Cu-(0–15%)TiH containing up to 5% native Cu O were manufactured by high energy ball milling and then hot-pressed to produce bulk nanostructured copper–matrix alloys reinforced by Cu Ti O inclusions. Two high-energy ball-milling (HEBM) protocols were employed for the fabrication of Cu-Ti alloys: single-stage and two-stage ball milling, resulting in an order of magnitude refinement of TiH particles in the reactive mixtures. Single-stage HEBM processing led to the partial retention of Ti in the microstructure of hot-pressed specimens as the α-Ti phase and formation of fine-grained (100–200 nm) copper matrix interspersed with 5–20 nm Cu Ti O precipitates, whereas the two-stage HEBM led to the complete conversion of TiH into the Cu Ti O phase during the hot pressing but produced a coarser copper matrix (1–2 μm) with 0.1–0.2 μm wide polycrystalline Cu Ti O layers on the boundaries of Cu grains. The alloy produced using single-stage HEBM was characterized by the highest strength (up to 950 MPa) and electrical conductivity (2.6 × 10 Sm/m) as well as the lowest specific wear rate (1.1 × 10 mm /N/m). The tribological performance of the alloy was enhanced by the formation of Cu Ti O microfibers in the wear debris, which reduced the friction coefficient against the Al O counter-body. The potential applications of the developed alloys are briefly discussed.
机译:反应性粉末复合材料Cu-(0-15%)Cu-(0-15%)通过高能量球磨制备高达5%天然Cu O的TiH,然后热压以产生通过Cu Ti O夹杂物增强的批量纳米结构铜基 - 基质合金。用于制造Cu-Ti合金的两个高能球铣削(Hebm)方案:单级和两级球磨,导致反应混合物中TIH颗粒的幅度细化顺序。单级Hebm处理导致了在热压样品的微观结构中部分保持的Ti,因为α-Ti相和细粒(100-200nm)铜基质的形成伴有5-20nm Cu Ti O沉淀物,而两级Hebm导致热压过程中TIH进入Cu Ti O相的完全转化,但在边界上产生较粗铜基质(1-2μm),较大的多晶Cu Ti O层。在界限上具有0.1-0.2μm宽的多晶Cu Ti O层Cu谷物。使用单级HEBM生产的合金的特征在于最高强度(高达950MPa)和电导率(2.6×10 SM / M)以及最低的特定磨损率(1.1×10mm / n / m)。通过在磨损碎片中形成Cu Ti O微纤维来增强合金的摩擦学性能,从而将摩擦系数与Al O反孔体积减小。简要讨论了开发合金的潜在应用。

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