COPPER OXIDE POWDER FOR CONDUCTIVE PASTE, METHOD FOR PRODUCING COPPER OXIDE POWDER FOR CONDUCTIVE PASTE, CONDUCTIVE PASTE, AND COPPER WIRING LAYER OBTAINED USING THE CONDUCTIVE PASTE

摘要

PROBLEM TO BE SOLVED: To provide: copper oxide powder for a conductive paste, capable of forming a copper wiring layer at low temperature without containing a surface protecting agent and a dispersant; a conductive paste including the copper oxide powder; and a low-resistant copper wiring layer formed using the conductive paste.;SOLUTION: Copper oxide powder for a conductive paste has a form where copper oxides having a substantially needle-like shape are assembled to be arranged substantially in the form of chestnuts in burrs or radially. The copper oxides having a substantially needle-like shape preferably have a long side of 200-700 nm, a short side of 10-150 nm, and an aspect ratio of 1.3-70. A conductive paste includes the copper oxide powder for a conductive paste and an organic solvent. A copper wiring layer is obtained by pattern printing using the conductive paste and performing reduction treatment to be formed into a conductor.;COPYRIGHT: (C)2013,JPO&INPIT