High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)

摘要

A novel interconnect technology, introducing thin film on a laminate substrate base is presented. A specially constructed laminate boardis used as a substrate for the thin film build-up process. The main characteristics of the laminate core substrate are the z-axis electricalconnections, the absence of holes in the substrate and the very flat nature of the top surface. As a result, the base substrate can beprocessed further in a thin film processing line. The manufacturing and properties of these substrates are discussed.