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Growth of SiC protective coating layers on graphite using single molecular precursors

机译:使用单分子前体在石墨上生长SiC保护涂层

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We have deposited thickn SiC thin films on graphite substrates at temperature range of 700 approx 850 deg C using single molecular precursors by thermal MOCVD and PEMOCVD methods for oxidation protection wear and tribological coating. Two organosilicon compounds such as diethylmethylsilane (DEMS), (Et)_2SiH(CH_3), and hexamethyldisilane (HMDS), (CH_3)_3Si-Si(CH-3)_3, were utilized as ingle source precursors, and hydrogen and Ar were used as a bubbler and carrier gas. Polycrystalline cublic SiC protective layers in [110] direction were successfully grown on graphite substrates at temperature as low as 800 deg C from HMDS by PEMOCVD. In the case of thermal MOCVD, on the other hand, only amorphous SiC layers were obtaind with either HMDS or DEMS at 850 deg C. We compared the difference of crystal quality and physical properties of the SiC protective layers grown by thermal MOCVD and PEMOCVD methods. PEMOCVD was highly effective process in improving the characteristics of film compared to those of thermal MOCVD. The optimum SiC film was obtained at 850 deg C and RF power of 200 W. The maximum deposition rate and microhardness are 2 mu m/h and 4,336 kg/mm~2Hv, respectively. The hardness was strongly influenced with the stocihiometry of SiC protective layeers. During CVD, the plasma diagnositcs and residual gas analysis were in situ carried out usikng optical emission spectroscopy (OES) and quadrupole mass spectrometer at various RF powers. The asgrown SiC protective layers were ex situ characterized with XRD, XPS, and SEM. the mechanical and oxidation-resistant properties have been checked with Knoop microhardness tester and TGA.
机译:我们已经使用单分子前驱物通过热MOCVD和PEMOCVD方法在石墨基板上700到850℃的温度范围内沉积了较厚的SiC薄膜,以进行氧化保护磨损和摩擦涂层。两种有机硅化合物(例如二乙基甲基硅烷(DEMS),(Et)_2SiH(CH_3)和六甲基二硅烷(HMDS),(CH_3)_3Si-Si(CH-3)_3)用作离子源前体,并使用了氢和Ar作为起泡剂和载气。通过PEMOCVD,在HMDS低至800摄氏度的温度下,成功地在[110]方向上的多晶立方SiC保护层上生长了石墨。另一方面,在热MOCVD的情况下,仅在850℃下通过HMDS或DEMS可获得非晶SiC层。我们比较了通过热MOCVD和PEMOCVD方法生长的SiC保护层的晶体质量和物理性质的差异。与热MOCVD相比,PEMOCVD是改善膜特性的高效方法。最佳的SiC薄膜是在850℃和200 W的RF功率下获得的。最大沉积速率和显微硬度分别为2μm / h和4,336 kg / mm〜2Hv。硬度受SiC保护层的化学计量学影响。在CVD期间,使用光发射光谱(OES)和四极质谱仪在各种RF功率下就地进行了等离子体诊断和残留气体分析。用XRD,XPS和SEM对生长的SiC保护层进行了原位表征。机械性能和抗氧化性能已通过努氏显微硬度测试仪和TGA进行了检查。

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