首页> 外文会议>Society of Vacuum Coaters annual technical conference >Growth of SiC protective coating layers on graphite using single molecular precursors
【24h】

Growth of SiC protective coating layers on graphite using single molecular precursors

机译:使用单分子前体石墨的SiC保护涂层的生长

获取原文

摘要

We have deposited thickn SiC thin films on graphite substrates at temperature range of 700 approx 850 deg C using single molecular precursors by thermal MOCVD and PEMOCVD methods for oxidation protection wear and tribological coating. Two organosilicon compounds such as diethylmethylsilane (DEMS), (Et)_2SiH(CH_3), and hexamethyldisilane (HMDS), (CH_3)_3Si-Si(CH-3)_3, were utilized as ingle source precursors, and hydrogen and Ar were used as a bubbler and carrier gas. Polycrystalline cublic SiC protective layers in [110] direction were successfully grown on graphite substrates at temperature as low as 800 deg C from HMDS by PEMOCVD. In the case of thermal MOCVD, on the other hand, only amorphous SiC layers were obtaind with either HMDS or DEMS at 850 deg C. We compared the difference of crystal quality and physical properties of the SiC protective layers grown by thermal MOCVD and PEMOCVD methods. PEMOCVD was highly effective process in improving the characteristics of film compared to those of thermal MOCVD. The optimum SiC film was obtained at 850 deg C and RF power of 200 W. The maximum deposition rate and microhardness are 2 mu m/h and 4,336 kg/mm~2Hv, respectively. The hardness was strongly influenced with the stocihiometry of SiC protective layeers. During CVD, the plasma diagnositcs and residual gas analysis were in situ carried out usikng optical emission spectroscopy (OES) and quadrupole mass spectrometer at various RF powers. The asgrown SiC protective layers were ex situ characterized with XRD, XPS, and SEM. the mechanical and oxidation-resistant properties have been checked with Knoop microhardness tester and TGA.
机译:通过热MOCVD和PEMOCVD方法在700大约850℃的温度范围内存在700大约850℃的温度范围内存在石墨基板上,用于氧化保护磨损和摩擦涂层。两个有机硅化合物如二乙基甲基硅烷(DEMS),(ET)_2SIH(CH_3)和六甲基二硅烷(HMDS),(CH_3)_3SI-SI(CH-3)_3被用作菱形源前体,并使用氢气和Ar作为喷泡器和载气。在[110]方向上的多晶ublic SiC保护层在通过PEMOCVD的HMDS的温度下成功地在石墨底物上生长在石墨底物上。另一方面,在热MOCVD的情况下,仅在850℃下使用HMDS或DEM获得无定形SIC层。我们比较了通过热性MOCVD和PEMOCVD方法种植的SiC保护层的晶体质量和物理性质的差异。 PEMOCVD与热MOCVD相比,在提高薄膜的特性方面是高效的过程。在850℃和200W的RF功率下获得最佳SiC膜。最大沉积速率和微硬度分别为2μm/ h和4,336kg / mm〜2hv。用SiC保护性除渣的钟度测量强烈影响硬度。在CVD期间,等离子体诊断和残留气体分析原位在各种RF功率下进行USIKNG光发射光谱(OES)和四极孔质谱仪。以XRD,XPS和SEM为特征的原位是出于原位的。用Knoop微硬度测试仪和TGA检查了机械和抗氧化性能。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号