Study on the Under Bump Metallurgy(UBM) of Electro-Plated Eutectic Pb/Sn Solder Bumps on Organic Substrates

摘要

In flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps, a highly reliable Under Bump Metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems, such as 1#mu#m Al/0.2#mu#m Ti/5#mu#m Cu, 1#mu#m/0.2#mu#m Ti/1#mu#m Cu, 1#mu#m Al/0.2#mu#m Ni/1#mu#m Cu, 1#mu#m Al/0.2#mu#m Ti/1#mu#m Cu/0.2#mu#m NiV, 1#mu#m Al/0.2#mu#m Pd/1#mu#m Cu have been investigated with regard to their interfacial reactions and adhesion properties under eutectic Pb/Sn solder bumps.