Flip chip packages are becoming increasingly popular in the microelectronics industry to meet the need for product miniaturization and increased device input and output (i/o). Advanced products such as cell phones, ocmputers, smart cards and pagers are getting smaller and becoming more powerful. Flip chips offer a smaller package outline with greater electrical interconnections necessary to meet the performance and demands of these advanced products. However, when a flip chip is assembled the electrical connections are no longer visible as they are with conventional perimeter leaded devices. Optical imaging methods are rendered obsolete in assuring the integrity of the electrical interconnects and bonded itnerfaces within the flip chip package since they are hidden by the chip itself. Without a method to assure the integrity of critical interfaces, control of the process and ultimately long term reliability of the device becomes questionable.
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