首页> 外文会议>Symposium on ferroelectric thin films >FERROELECTRIC C-AXIS ORIENTED Pb_5Ge_3O_(11) THIN FILMS FOR ONE TRANSISTOR MEMORY APPLICATION
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FERROELECTRIC C-AXIS ORIENTED Pb_5Ge_3O_(11) THIN FILMS FOR ONE TRANSISTOR MEMORY APPLICATION

机译:用于一个晶体管内存应用的铁电C轴取向PB_5GE_3O_(11)薄膜

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One transistor memory devices have been proposed recently. To meet the needs of one transistor memory applications, C-axts oriented Pb_5Ge_3O_(11) (PGO) thin films were prepared using metalorganic chemical vapor deposition (MOCVD) and rapid thermal processing (RTP). It was found that the nucleation of C-axis Pb_5Ge_3O_(11) phase started at a deposition temperature below 400°C and grain growth dominated at 500°C or above. With increasing annealing temperature, the remanent polarization (Pr) and coercive field (Ec) values increased, and the hysteresis loops of the Pb_5Ge_3O_(11) films were well saturated and symmetrical after the post-annealing. The C-axis PGO thin film showed good ferroelectric properties at 5V: 2Pr and 2Ec values were 2.0 - 4.0 μC/cm~2 and 90 - 110 kV/cm, respectively. The films also showed excellent fatigue characteristics: no fatigue was observed up to 1 × 10~9 switching cycles. The retention and imprint properties have also been studied. The leakage currents of the PGO films were 2-5×10~(-7) A/cm~2 at 100 kV/cm and dielectric constants were 40 - 70. The high quality MOCVD Pb_5Ge_3O_(11) films can be used for single transistor ferroelectric memory devices.
机译:最近已经提出了一个晶体管存储器件。为了满足一个晶体管内存应用的需要,使用金属有机化学气相沉积(MOCVD)和快速热处理(RTP)制备C-AXTS定向的PB_5GE_3O_(11)(PGO)薄膜。发现C轴PB_5GE_3O_(11)相的成核在低于400℃的沉积温度下开始,在500℃或更高的晶粒生长中。随着退火温度的增加,剩余极化(PR)和矫顽场(EC)值增加,并且在退火后,PB_5GE_3O_(11)膜的滞后环是良好的饱和和对称的。 C轴PGO薄膜在5V下显示出良好的铁电性能:2PR和2EC值分别为2.0-4.0μC/ cm〜2和90-110kV / cm。该薄膜还表现出优异的疲劳特性:没有疲劳观察到高达1×10〜9的切换循环。还研究了保留和压印特性。 Pgo膜的泄漏电流在100kV / cm的100kV / cm和介电常数下为2-5×10〜(-7)A / cm〜2。高质量的MOCVD PB_5GE_3O_(11)薄膜可用于单一晶体管铁电存储器件。

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