C-axis oriented thin film ferroelectric transistor memory cell and method of manufacturing the same

摘要

A method of forming the c-axis FEM cell semi-conductor structure includes forming a semiconductor structure having a ferroelectric memory (FEM) gate unit on a substate of single crystal silicon; forming a conductive channel of a first type for use as a source junction region and a drain junction region; forming a conductive channel of a second type to act as a gate junction region between the source junction region and drain junction region; depositing an FEM gate unit over the gate junction region, including depositing a lower electrode, a c-axis oriented Pb5Ge3O11 FE layer and an upper electrode, wherein the FEM gate unit is sized on the gate junction region such that any edge of the FEM gate unit is a distance "D" from the edges of the source junction region and the drain junction region, and depositing an insulating structure about the FEM gate unit. The structure of the c-axis FEM cell semiconductor includes a silicon substate; a source junction region and a drain junction region located in the substrate; a gate junction region located between the source junction region and the drain junction region; a FEM gate unit including a lower electrode, a c-axis oriented Pb5Ge3O11 FE layer and an upper electrode; wherein the FEM gate unit is sized on the gate junction region such that any edge of said BEM gate unit is a distance "D" from the edges of the source junction region and the drain junction region; an insulating layer, having an upper surface, overlying the junction regions, the FEM gate unit and the substrate; and source, drain and gate electrodes. IMAGE