Reliability of Chip Capacitors in Plastic Pin Grid Array (PPGA) Packages

机译：塑料引脚网格阵列（PPGA）封装中的芯片电容器的可靠性

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A decrease in the capacitance of the decoupling capacitors on the PPGA package was observed to account for approx2

机译：观察到PPGA封装上去耦电容器的电容减小，约占2％。

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《Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97》|1997年|p.1695-1700|共6页
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Deepak Goyal Mirng-Ji Lii;
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中图分类无线电电子学、电信技术;
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4. Reliability chip capacitors in plastic pin grid array (PPGA) packages [C] . Deepak Goyal, Mirng-Ji Lii Pacific Rim/ASME international intersociety electronic photonic packaging conference . 1997

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Reliability of Chip Capacitors in Plastic Pin Grid Array (PPGA) Packages

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