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A MACHINE-VISION BASED APPROACH TO LOW-COST OPTOELECTRONIC PACKAGING

机译:一种基于机器视觉的低成本光电封装方法

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At present, the high cost of optoelectronic (OE) devices is largely due to the labor-intensive processes involved with packaging. Automating the packaging processes should result in a significant cost reduction. One of the most labor-intensive steps is aligning and attaching the fiber to the OE device, the so-called pigtailing process. Three low-cost machines were designed and built under an ARPA-funded project to perform sub-micron alignments and attachments of single-mode fibers to different OE devices. These Automated Fiber Pigtailing Machines (AFPMs) are compatible with a manufacturing environment and have a modular design for standardization of parts, and machine vision for maximum flexibility. The vision system greatly reduces mechanical fixturing constraints by requiring the critical components to be positioned only within the field of view of the camera. Object-recognition algorithms written by LLNL allow the AFPM to determine the initial locations of the OE device and the fiber. The performance goals of the AFPM are to perform each pigtailing operation in less than 3 minutes (including the epoxy curing time) and to operate unattended for up to 1 hour. The modular nature of the AFPM means that each machine may be easily customized for a particular application. This work was a collaboration among Uniphase Telecommunications Products (formerly United Technologies Photonics, UTP), Ortel, Newport Corporation, the Massachusetts Institute of Technology Manufacturing Institute (MIT), and Lawrence Livermore National Laboratory (LLNL).
机译:目前,光电(OE)器件的高成本很大程度上是由于涉及包装的劳动密集型过程。使包装过程自动化将大大降低成本。最费力的步骤之一是将光纤对准并连接到OE设备,即所谓的尾纤工艺。在ARPA资助的项目下设计并制造了三台低成本机器,以进行亚微米对准以及将单模光纤连接到不同的OE设备。这些自动光纤尾纤机(AFPM)与制造环境兼容,并具有用于零件标准化的模块化设计,以及具有最大灵活性的机器视觉。视觉系统通过仅将关键组件放置在摄像机的视场内,大大降低了机械固定约束。 LLNL编写的对象识别算法使AFPM可以确定OE设备和光纤的初始位置。 AFPM的性能目标是在不到3分钟的时间内(包括环氧树脂固化时间)执行每个尾纤操作,并在无人看管的情况下运行长达1个小时。 AFPM的模块化性质意味着可以针对特定应用轻松定制每台机器。这项工作是Uniphase电信产品公司(以前是United Technologies Photonics,UTP),Ortel,Newport Corporation,麻省理工学院制造研究所(MIT)和劳伦斯·利弗莫尔国家实验室(LLNL)的合作。

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