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The influence of substrate bias fixed charge in the buried insulator on the gain of the parasitic bipolar inherent in silicon-on-insulator MOSFETs

机译:掩埋绝缘体中衬底偏置固定电荷对绝缘体上硅MOSFET固有的寄生双极增益的影响

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When Silicon-On-Insulator (SO) MOSFETS are operated at high drain voltages, the drain-source current becomes strongly influenced by the common emitter current gain of the parasitic, lateral bipolar transistor. For small channel lengths, the gain is limited only by the emitter efficiency and bipolar action can then give rise to high off-state leakage. From measurements performed on lateral SOI diodes it is demonstrated that the recombination rate in the source/body depletion region can be enhanced by the application of a substrate bias sufficient to cause depletion at the body/buried oxide interface, This results in a reduction in the common emitter current gain and from Gummel plots a reduction in gain of 20% was measured for an increase in substrate voltage of 5 volts. Also, fixed positive charge in the buried oxide is expected to produce the same effect for an n-channel transistor, as a depletion region will form automatically at the body/buried oxide interface.
机译:当绝缘体上硅(SO)MOSFET在高漏极电压下工作时,寄生横向双极晶体管的公共发射极电流增益会严重影响漏极-源极电流。对于较小的通道长度,增益仅受发射极效率的限制,然后双极作用会引起高的关态泄漏。从在横向SOI二极管上进行的测量表明,通过施加足以在主体/埋入式氧化物界面处引起耗尽的衬底偏压,可以提高源/主体耗尽区中的复合速率。常见的发射极电流增益,以及从Gummel曲线得出的结果,随着基板电压增加5伏,增益降低了20%。此外,由于耗尽区将在体/掩埋氧化物的界面自动形成,因此掩埋氧化物中固定的正电荷有望对n沟道晶体管产生相同的效果。

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