SURFACE-MOUNTING OF POWER DEVICES TO ALUMINUM HEAT SINKS

摘要

All-polyimide heat-sealing with our proprietary TPI bond film of copper to aluminum heat sinks convert tough thermal management applications into surface-mount applications. TPI bond film is the basis of products for a range of thermal management electronic packaging formats: 1. PowerSite~(TM)solderable pads enable the solder attachment of discrete power devices, such as a TO-220s or TO-247s, directly to an aluminum heat sink. 2. PowerFlex~(TM) technology bonds complex power circuits directly to aluminum heat sinks. 3. PowerVia~(TM) thermal columns provide an all-metal thermal connection of PCB SMT-mounted power devices, such as a D2-Paks, to an aluminum heat sink. These technologies offer improved performance, as well as lower cost over conventional constructions.