PACKAGE DEVELOPMENT FOR HIGH MOISTURE AND REFLOW SENSITIVITY LEVELS

摘要

Environmental concerns about the use of lead based solders in electronics have led to lead-free replacement alloys that require higher reflow temperatures. This requirement, combined with the desire to improve package floor life exposure before assembly, has driven tremendous package development activity over the past several years. This paper describes some of the major failure modes for packages that see elevated moisture levels and reflow temperatures, and provides some approaches to improving package moisture sensitivity levels by addressing key material, process, and design factors.