Equipment for processing by gas cluster ion beams

摘要

Gas cluster ions represent emerging new technology for atomic scale processing of surfaces. Applications which have been recognized for gas cluster ion beams include ultra-shallow implantation, surface eleaning, smoothing and planarization, micromachining reactive formation of films, and ultra-shallow sputtering for high-resolution surface analysis. Gascluster ion beam systems for manufacturing applications will requuire substantially higher beam currents than are presently available and other features which have not been associated with laboratory equipment constructured to date. This paper reviews the status of existing gas cluster ion beam equipment and discusses anticipated requirements for future high-throughput processors.