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Voltage limiters suitable to DRAMs with substrate-plate electrode memory cells

机译:适用于带有基板电极存储单元的DRAM的电压限制器

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Substrate-plate electrode (SPE) memory cells, like BSE cell [1], SPT cell [2], and TTC [3], are foreseen as candidate cells for DRAMs of 4-Mbits or beyond, because of their compact cell size and inherent immunity against alpha-particle induced soft errors, SPE cells consist of the buried storage electrode in a capacitor trench and the heavily doped substrate as the capacitor counter-electrode. Therefore, SPE cells don't need the extra cell-plate electrode wiring, which is needed for the conventional trench cells. Figure 1 shows a diagram for a typical SPE cell, a BSE cell. To obtain sufficient operational margin for DRAMs with SPE cells, as the cell storage voltage varies approximately in proportion to the substrate voltage (Vsub) variation, Vsub variations should be suppressed.
机译:像BSE单元[1],SPT单元[2]和TTC [3]这样的基板电极(SPE)存储单元由于其紧凑的单元尺寸和较小的容量而被预选为4 Mbit或更大DRAM的候选单元。 SPE电池具有固有的抗α粒子诱发的软错误的能力,它由电容器沟槽中的掩埋存储电极和作为电容器反电极的重掺杂衬底组成。因此,SPE电池不需要传统的沟槽电池所需的额外的电池板电极布线。图1显示了典型的SPE单元BSE单元的示意图。为了获得具有SPE单元的DRAM的足够的操作裕度,因为单元存储电压大约与基板电压(Vsub)变化成比例地变化,所以应抑制Vsub变化。

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