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Unique reliability characteristics of multiwire^™ interconnection boards compared to multilayer printed circuits

机译：与多层印刷电路相比，multiwire ^{™互连板具有独特的可靠性特征}

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Test data and field experience have shown that the Multiwire technology as compared to multilayer technology provides a means of achieving high connectivity with equally high reliability.

机译：测试数据和现场经验表明，与多层技术相比，Multiwire技术提供了一种以同样高的可靠性实现高连接性的方法。

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《EIC Electrical Insulation Conference》|1975年|40-44|共5页
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Joseph P. Hammond;
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1. Circuit model and signal integrity analysis for multilayer printed circuit board interconnection [J] . Fan Kong, Weixing Sheng, Xiaofeng Ma, International journal of RF and microwave computer-aided engineering . 2014,第4期

机译：多层印刷电路板互连的电路模型和信号完整性分析
2. Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections [J] . Xavier de la Bro?se, Alain Le Coguie, Jean-Luc Sauvageot, Journal of Low Temperature Physics . 2018,第3a4期

机译：超导多层高密度柔性印刷电路板，用于非常高的热阻互连
3. Effect of Different Surface Finishes on Bending Reliability of the Rigid Printed Circuit Board and Flexible Printed Circuit Board Substrate Joints with the Transverse Ultrasonic Bonding Process [J] . Lee Jong Gun, Lee Jong-Bum, Kim Sang-Woo, Nanoscience and Nanotechnology Letters . 2019,第6期

机译：不同表面对横向超声波粘接工艺刚性印刷电路板弯曲可靠性的影响及柔性印刷电路板基座接头
4. Unique reliability characteristics of multiwire? interconnection boards compared to multilayer printed circuits [C] . Joseph P. Hammond EIC Electrical Insulation Conference . 1975

机译：与多层印刷电路相比，Multiwire ^{互联板的独特可靠性特性}
5. Large-area, low-cost via formation and metallization in multilayer thin film interconnection on printed wiring boards (PWB) [D] . Li, Weiping 1999

机译：印刷线路板（PWB）上多层薄膜互连中的大面积，低成本通孔形成和金属化
6. Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix [O] . Shantonu Biswas, Andreas Schoeberl, Yufei Hao, -1

机译：集成多层可拉伸印刷电路板为可变形有源矩阵铺平了道路
7. Special Articles: The Problem of Evaluation of Insulation Reliability for Printed Circuit Boards. Measurement Techniques of Dielectric Characteristics Suitable for Electrical Insulating Materials Used for Printed Circuit Boards and Their Application to the Estimation of Reliability on Insulation Properties. [O] . Eiki WATANABE 1995

机译：特殊文章：印刷电路板绝缘可靠性评价问题。适用于用于印刷电路板的电绝缘材料的介电特性的测量技术及其在绝缘性能估计的应用中的应用。

Unique reliability characteristics of multiwire™ interconnection boards compared to multilayer printed circuits

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Unique reliability characteristics of multiwire^™ interconnection boards compared to multilayer printed circuits