INTERLAYER CONNECTION STRUCTURE OF MULTILAYER INTERCONNECTION BOARD, MANUFACTURING METHOD AND LAND SECTION FORMATION METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To inexpensively manufacture an FPC used for a large-current circuit, to inexpensively form a highly reliable land section, and to form a land section at an arbitrary section without extending the circuit length of a multilayer interconnection board.;SOLUTION: Land sections 111a-111c where a conductive pattern is exposed by releasing a base film 10 are formed at a specific position of each base film 10 in a plurality of flexible printed circuit boards 110a-110c where a conductive pattern made of copper foil 2 is formed on the base film 10. Land sections are allowed to correspond to one another and each of flexible printed circuit boards 110a-110c is laminated, and each conductive pattern is welded in the land section. As one manufacturing method, a hot-melt resin 3 is applied to the copper foil 2 and is pinched by a magnet cylinder 4 having a mold and a work roll 5, and the conductive pattern and a bridge section are cut. The cut copper foil 2 is laminated via the base film 10 and the hot-melt resin 3 to complete a copper-clad laminate 12. A coverlay 16 is formed as desired to complete a flexible printed circuit board.;COPYRIGHT: (C)2003,JPO