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Simulation Analysis of Selective Cooling for Correcting Unbalanced Temperature of Multiple Power Dies in SiC Power Modules

机译:校正校正多功能模块不平衡温度的选择性冷却的仿真分析

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This paper explores the application of a Peltier thermoelectric module in selectively correcting unbalanced temperatures of multiple power dies in SiC power modules. This supportive cooling can address thermoelectric effects' advantages without demanding substantial powers needed to create a meaningful temperature gradient. Our concept is validated by two-step multiphysics finite element (FE) simulations. For conservativeness, the first simulation models a commercial Peltier module, instead of state-of-art materials, and confirms similar thermal characteristics with its datasheet. In the second simulation, the developed Peltier model is now integrated with an example SiC power module having a not-optimized liquid cooler. Simulation results exhibit better balanced die temperatures in this simulation condition.
机译:本文探讨了珀耳帖热电模块在选择性地校正SiC电源模块中的多功率模具的不平衡温度中的应用。这种支持性冷却可以解决热电效应的优点,而无需要求产生有意义的温度梯度所需的大量功率。我们的概念由两步多体性有限元(FE)模拟验证。为了保守,第一仿真模拟商业珀耳帖模块,而不是最先进的材料,并用其数据表确认类似的热特性。在第二仿真中,开发的Peltier模型现在与具有未优化液体冷却器的示例性SiC电源模块集成。仿真结果在该模拟条件下表现出更好的平衡芯片温度。

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