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ESD protection design for high-speed I/O interface of stub series terminated logic (SSTL) in a 0.25-/spl mu/m salicided CMOS process

机译:0.25- / spl mu / m硅化CMOS工艺中的存根串联终端逻辑(SSTL)高速I / O接口的ESD保护设计

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ESD protection design for high-speed I/O interface of stub series terminated logic (SSTL) is proposed. The SSTL I/O buffer with the proposed ESD protection design, which is designed to operate with a clock of 400 MHz, has been fabricated and verified in a 0.25-/spl mu/m salicided CMOS process. The human-body-model (HBM) and machine-model (MM) ESD levels of this SSTL I/O buffer can be greater than 8 kV and 750 V, respectively. Based on the excellent ESD performance, one set of area-efficient I/O cell library for SSTL in 1.8 V applications with this ESD protection design has been built up in a 0.25-/spl mu/m salicided CMOS process.
机译:提出了短截线端接逻辑(SSTL)高速I / O接口的ESD保护设计。具有拟议的ESD保护设计的SSTL I / O缓冲器设计用于以400 MHz的时钟工作,并已在0.25- / spl mu / m硅化CMOS工艺中进行了制造和验证。此SSTL I / O缓冲区的人体模型(HBM)和机器模型(MM)ESD级别分别可以大于8 kV和750V。基于出色的ESD性能,采用0.25- / spl mu / m硅化CMOS工艺构建了一套具有1.8V应用中SSTL的面积有效的I / O单元库,具有这种ESD保护设计。

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