mixed analogue-digital integrated circuits; integrated circuit measurement; integrated circuit modelling; integrated circuit noise; electric noise measurement; substrates; substrate noise propagation; lightly doped p-type substrate; mixed-signal IC; multidimensional current flow; adjacent layout detail propagation influence; nwells; metal wires; S21 propagation; 0 Hz to 10 GHz;
机译:轻掺杂基板上RF CMOS的基板耦合,用于纳米级混合信号设计
机译:轻掺杂基板上LC-VCO和数字调制解调器的基板噪声产生,隔离和影响建模
机译:低阻体外延工艺中地弹感应衬底噪声耦合的分析:最小化混合信号芯片上噪声影响的设计策略
机译:轻掺杂基板中基板噪声传播分析混合信号ICS
机译:并行基板耦合噪声建模和主动降噪方法,用于混合信号物理设计。
机译:独立式GaN衬底上注入Mg和掺杂Mg的GaN层中缺陷的比较分析
机译:一种测量轻掺杂衬底上UWB频带衬底噪声的方法
机译:轻掺杂硅衬底中计算高效的衬底噪声耦合估计