A test chip and step-by-step procedure for MEMS material property determination using micromachined structures

摘要

We present a test chip and step-by-step procedure for MEMS material property determination, including residual stress (RS), Young's modulus (YM), thermal expansion coefficient (TEC), temperature resistivity coefficient (TRC), and thermal conductive coefficient (TCC). The test chip consists of one basic micromachined test structure and can be extended to a broader class of test structures. The required experimental apparatus are an optical microscope along with a heating stage, probe stages, and a power supply. Analytical models are derived for the task of extracting the properties. Experimental results with phosphorous-doped LPCVD poly crystalline silicon films are used to demonstrate the effectiveness of the proposed method.