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Influence of isochronal annealing on the evolution of hole traps in GaAsN epilayers grown by metalorganic chemical vapor deposition

机译:等时退火对金属有机化学气相沉积生长GaAsN外延层中空穴陷阱演化的影响

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The evolution of electrically active defects in rapid thermally annealed p-type GaAsN epitaxial layers grown by metalorganic chemical vapor deposition (MOCVD) was studied by deep level transient spectroscopy (DLTS). A continuous distribution of hole traps and an overlapping minority carrier trap are observed in the as-grown layers. Six hole traps HA1 (E/sub V/+0.22 eV), HA2 (E/sub V/+0.32 eV), HA3 (E/sub V/+0.38 eV), HA4 (E/sub V/+0.39 eV), HA5 (E/sub V/+0.55 eV), and HA6 (E/sub V/+0.78 eV) were created by rapid thermal annealing (RTA) in the temperature range of 600/spl deg/C-900/spl deg/C for 30 s. Most of these defects are stable at 900/spl deg/C, although their relative concentrations varied over the RTA temperature. The origin of these hole traps was studied based on previously reported hole traps in the literature.
机译:通过深层瞬态光谱法(DLTS)研究了通过金属有机化学气相沉积(MOCVD)生长的快速热退火p型GaAsN外延层中电活性缺陷的演变。在生长的层中观察到空穴陷阱的连续分布和少数载流子的重叠。六个空穴阱HA1(E / sub V / + 0.22 eV),HA2(E / sub V / + 0.32 eV),HA3(E / sub V / + 0.38 eV),HA4(E / sub V / + 0.39 eV) ,HA5(E / sub V / + 0.55 eV)和HA6(E / sub V / + 0.78 eV)通过快速热退火(RTA)在600 / spl deg / C-900 / spl deg的温度范围内创建/ C 30秒。尽管这些缺陷的相对浓度随RTA温度的变化而变化,但大多数在900 / spl deg / C时是稳定的。这些空穴陷阱的起源是根据文献中先前报道的空穴陷阱进行研究的。

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