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Substrate-induced high-frequency noise in deep sub-micron MOSFETs for RF applications

机译:用于射频应用的深亚微米MOSFET中衬底引起的高频噪声

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We present results from high-frequency noise measurements on NMOS devices fabricated in a 0.5-/spl mu/m epi-based CMOS process. These noise measurements at RF frequencies reveal the existence of substrate-induced high-frequency noise in transistors operating in the saturation regime. The substrate-induced noise is independent of the transistor bias conditions, but is strongly dependent on the geometry of the device and the MOS gate-to-bulk capacitance. A new ac noise model for CMOS devices operating at RF frequencies presented here shows good conformity to measurements. Its implications are emphasized via the design of a low-noise amplifier (LNA) operating at 2 GHz. The minimum achievable noise-figure (NF) can be higher by as much as 0.6 dB due to this substrate-induced high-frequency noise.
机译:我们介绍了在0.5- / spl mu / m基于Epi的CMOS工艺中制造的NMOS器件上的高频噪声测量结果。这些在RF频率下的噪声测量结果表明,在饱和状态下工作的晶体管中存在衬底引起的高频噪声。衬底引起的噪声与晶体管偏置条件无关,但在很大程度上取决于器件的几何形状和MOS栅至体电容。此处介绍的用于在RF频率下工作的CMOS器件的新的交流噪声模型显示出与测量的良好一致性。通过设计在2 GHz下运行的低噪声放大器(LNA)来强调其含义。由于这种基底引起的高频噪声,最小可达到的噪声系数(NF)可能高达0.6 dB。

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