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High quality InGaAsP grown by solid source molecular beam epitaxy using valve arsenic and phosphorous cracker cells

机译:固体源分子束外延生长的高质量InGaAsP,使用阀砷和磷裂化器电池

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InGaAsP materials grown by solid source molecular beam epitaxy using valve arsenic and phosphorous cracker cells are Investigated. The lattice-matched undoped In/sub 0.7/Ga/sub 0.3/As/sub 0.68/P/sub 0.32/ shows a strong emission spectrum peaking at 0.875 eV at room temperature with a full width at half maximum of 37.4 meV, good electrical properties and smooth surface. The incorporation efficiency of arsenic is found to be higher than that of phosphorous in almost all arsenic pressure, and can be described well by a polynomial expression with respect to the beam equivalent pressure ratio f/sub As//(f/sub As/+f/sub p/). The unintentionally doped layers grown at beam equivalent pressure ratios between 0.4 and 0.5 show high Hall mobility, low net carrier concentration and small surface roughness. Less and excess arsenic pressure is find to deteriorate the quality of the layers. It is also found that the materials grown at beam equivalent pressure ratios greater than 0.35 are all n-type at 77 K, but p-type for those grown below 0.35, indicating a strong amphoteric behaviour of carbon impurities.
机译:研究了使用阀砷和磷裂化细胞通过固体源分子束外延生长的InGaAsP材料。晶格匹配的未掺杂In / sub 0.7 / Ga / sub 0.3 / As / sub 0.68 / P / sub 0.32 /在室温下显示出在0.875 eV处达到峰值的强发射光谱,其半峰全宽为37.4 meV,电气良好性能和光滑的表面。发现在几乎所有砷压力下,砷的掺入效率都高于磷,并且可以通过相对于束当量压力比f / sub As //(f / sub As / +的多项式来很好地描述f / sub p /)。以0.4至0.5的束当量压力比生长的无意掺杂层显示出高的霍尔迁移率,低的净载流子浓度和较小的表面粗糙度。发现更少和过量的砷压力会降低层的质量。还发现以束当量压强比大于0.35生长的材料在77 K时均为n型,而对于低于0.35生长的材料则为p型,这表明碳杂质具有很强的两性行为。

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