Accelerated reliability predictions-thermomechanical fatigue solder joints methodology

摘要

A generalized finite element based approach for estimating the reliability of solder joint for surface mount packages is presented in this study. The methodology is based on the viscoplastic constitutive law for the solder response and the crack growth rate model for solder joint fatigue. An accelerated life prediction model is developed for eutectic Sn-Pb solder joints assuming a two-parameter Weibull failure distribution.