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A RF lateral BJT on SOI for realization of RF SOI-BiCMOS technology

机译:SOI上的RF横向BJT,用于实现RF SOI-BiCMOS技术

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This work presents a lateral RF BJT built on SOI-CMOS compatible substrate. The primary motivation is to realize a SOI-BiCMOS technology suitable for low power RF and mixed-signal SoC. This novel LBJT structure relies on a self-aligned polysilicon side-wall-spacer (PSWS) to connect the base contact to the intrinsic base with dimensions in 100 nm range. The fabricated LBJTs exhibit superior Johnson's product (f/sub /spl tau///spl times/BV/sub CEO/) in the range between 190-300 GHz/spl middot/V. The f/sub max/ of the optimal device reaches 46 GHz at collector current density of only 0.15 mA//spl mu/m/sup 2/. Both figure-of-merits are in-line with advanced SiGe-HBT devices, and superior than previously published data on lateral BJTs.
机译:这项工作提出了在SOI-CMOS兼容基板上构建的横向RF BJT。主要动机是实现一种适用于低功率RF和混合信号SoC的SOI-BiCMOS技术。这种新颖的LBJT结构依靠自对准多晶硅侧壁间隔物(PSWS)将基极触点连接到尺寸在100 nm范围内的本征基极。制成的LBJT表现出在190-300 GHz / spl middot / V之间的卓越Johnson产品(f / sub / spl tau /// spl times / BV / sub CEO /)。最佳器件的f / sub max /在集电极电流密度仅为0.15 mA // spl mu / m / sup 2 /时达到46 GHz。两者的优点均与先进的SiGe-HBT器件相符,并且优于以前发布的有关横向BJT的数据。

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