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The SCC BJT: a high-performance bipolar transistor compatible with high-density deep-submicrometer BiCMOS SRAM technologies

机译:SCC BJT:与高密度深亚微米BiCMOS SRAM技术兼容的高性能双极晶体管

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摘要

We present the process development and device characterization of the Selectively Compensated Collector (SCC) BJT specifically designed for high-density deep-submicrometer BiCMOS SRAM technologies. This double-poly BJT takes advantage of the self-aligned polysilicon layers of the SRAM bit cell to obtain high performance without adding excessive process complexity. Furthermore, although an NPN device, the SCC BJT is formed in a lightly doped p-well in which the collector is formed with a single 370 keV phosphorus implant to minimize parasitic junction capacitances without the use of trench isolation or recessed oxides. The suitability of this bipolar structure outside of its original FSRAM intent is proven with its potential for bipolar logic and mixed-mode RF applications. ECL delays of 50 ps at 200 /spl mu/A and a CML power-delay product of 4.5 fJ at 1.1 V supply were obtained. A 900 MHz noise figure as low as 0.54 dB at 0.5 mA with an associated gain of 14.7 dB was demonstrated as well as a dual modulus /spl divide/4/5 prescaler operating up to 3.3 GHz for a switch current of 200 /spl mu/A.
机译:我们介绍了选择性补偿收集器(SCC)BJT的工艺开发和器件特性,该器件专门为高密度深亚微米BiCMOS SRAM技术而设计。这种双多晶硅BJT利用SRAM位单元的自对准多晶硅层来获得高性能,而不会增加过多的工艺复杂性。此外,尽管是NPN器件,但SCC BJT形成于轻掺杂的p阱中,其中的集电极由单个370 keV的磷注入形成,以最大程度地减小寄生结电容,而无需使用沟槽隔离或凹陷的氧化物。这种双极性结构在其最初的FSRAM意图之外的适用性已通过其在双极性逻辑和混合模式RF应用中的潜力得到了证明。在1.1 V电源下,在200 / spl mu / A时的ECL延迟为50 ps,在4.5 fJ时的CML功率延迟乘积。演示了在0.5 mA时900 MHz噪声系数低至0.54 dB且相关增益为14.7 dB的情况,以及双模数/ spl除法/ 4/5预分频器在高达200 GHz / spl的开关电流下工作于3.3 GHz /一个。

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