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Small-signal intrinsic base resistance effect on InP-InGaAs, InGaP-GaAs and SiGe HBTs

机译:小信号本征基极电阻对InP-InGaAs,InGaP-GaAs和SiGe HBT的影响

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In this paper, a comprehensive analysis of the effect of small-signal intrinsic base resistance (Rbin) on the RF performances of InP-InGaAs (Gao et al., 2004), InGaP-GaAs (Bousnina et al., 2004), and SiGe HBTs are demonstrated for the first time. It was found that for these HBTs, both the real part of the equivalent input impedance (Re(Zin)) and the real part of the equivalent output impedance (Re(Zout)) increase with the increase of the intrinsic base resistance Rbin. Therefore, an increase of R bin (i.e. reducing the base doping, the base width, and the base edge length in the base contact side) makes the kink phenomena of both the scattering parameter S11 and S22 of these HBTs more obvious (Lu et al., 2001). These phenomena can be explained perfectly by our derived complete expressions of Zin and Z out at low and high frequencies. In addition, for relatively smaller Rbin, it was found that under constant collector-emitter voltage (VCE), an increase of base current (which corresponds to a decrease of base-emitter resistance (rpi ) and an increase of trans-conductance (gm)) enhances the anomalous dip. While for relatively larger Rbin, it was found that under constant VCE, an increase of base current obscures the anomalous dip. These phenomena can also be explained by our proposed theory
机译:本文全面分析了小信号本征基极电阻(R bin )对InP-InGaAs(Gao等人,2004),InGaP-GaAs(Bousnina)的RF性能的影响。等人(2004年),并首次证明了SiGe HBT。发现对于这些HBT,等效输入阻抗的实部(Re(Z in ))和等效输出阻抗的实部(Re(Z out ))随着本征基极电阻R bin 的增加而增加。因此,R bin 的增加(即减少基极掺杂,基极宽度和基极接触侧的基边长度)会导致散射参数S 11的扭结现象这些HBT的和S 22 更为明显(Lu等,2001)。这些现象可以通过我们导出的Z in 和Z out 在低频和高频下的完整表达式来完美解释。另外,对于相对较小的R bin ,发现在恒定的集电极-发射极电压(V CE )下,基极电流增加(对应于R CE 的减小)。基极-发射极电阻(r pi )和跨导的增加(g m )会增加异常倾角。对于相对较大的R bin ,发现在恒定的V CE 下,基极电流的增加掩盖了异常倾角。这些现象也可以用我们提出的理论来解释

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