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Modeling contact between rigid sphere and elastic layer bonded to rigid substrate

机译:建模刚性球体与粘合到刚性基板的弹性层之间的接触

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An approximate mechanical model is developed for predicting the radius of contact between a sphere and a layered substrate. The complex solution of Chen and Engel is reduced to the simple root finding procedure for the unknown contact radius. Numerical data from the model of Chen and Engel are obtained for several combinations of layer material. It is shown that with the proper selection of dimensionless parameters the numerical results fall on a single curve that is easily correlated. Radius predictions show good agreement with experimental measurements.
机译:开发了一种近似的机械模型,用于预测球体和分层基板之间的接触半径。对于未知的接触半径,Chen和Engel的复杂解决方案简化为简单的求根程序。对于层材料的几种组合,从Chen和Engel模型获得的数值数据。结果表明,通过正确选择无因次参数,数值结果落在一条易于关联的曲线上。半径预测显示与实验测量结果吻合良好。

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