Packaging for thermal management of power electronics building blocks using metal posts interconnected parallel plate structure

摘要

We have developed a low-cost approach, termed metal posts interconnected parallel plate structure (MPIPPS), for packaging high-performance power electronics building block (PEBB) modules. PEBBs are integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. This new packaging concept is based on the use of direct-bonding of copper posts, rather than wire-bonding of fine aluminium wires, to interconnect power devices. The approach requires less expensive equipment and has the potential to produce modules with superior electrical, thermal, and mechanical performance. We have demonstrated the feasibility of this approach by constructing PEBB modules consisting of two IGBTs, two power diodes, gate resistors, varistors, and a capacitor. The MPIPPS-packaged modules have been successfully tested at power levels over 6 kW.