Packaging of Power Electronics Building Blocks

摘要

The major objective of the PEBB research at CPES remains to support ONR's program to develop a new generation of electric ships based on the building block concept utilizing high voltage dc distribution. From the system point of view, the integrated power system (IPS) must be reliable and provide uninterrupted power supply to critical loads. The IPS should be based on the PEBB concept and should be reconfigurable and programmable via a high-level communication and control bus. This requires the development of programmable converters with high levels of intelligence and control autonomy, wide control bandwidths, and fail-safe capability. At present, high frequency power conversion technology has reached the point where further advances in semiconductor technology have limited benefit due to physical limitations of the current packaging methods. Package inductance, thermal handling, wire insulation, active and passive components, packaging materials, interconnect structures, thermal management, EMC and EMI, circuits and system integration, as well as manufacturing technologies are all important considerations for developing the correct packaging approach. At CPES we would adopt an integrated systems approach to standardize power electronics components and packaging techniques in the form of highly integrated Power Electronics Building Block modules. This approach makes possible an increased level of integration in the components that comprise a power electronics system: devices, circuits, controls, sensors, and actuators. These components are integrated into standardized manufacturable subassemblies and modules, which in turn, are customized for particular applications. By developing the PEBB based power electronics converters using an integrated systems approach, we will improve the quality, reliability, and cost-effectiveness of power electronics systems and reduce both the time and effort associated with design cycles for system application.