Reliability studies of leadless chip carrier assemblies using the integrated matrix creep method

摘要

Surface mounted Leadless Chip Carrier (LCC) are standard components used in military avionics and automotive applications. The strains induced in the solder material due to thermal cycling from power up and environmental effects need to be accurately determined in order to predict the reliability of these packages during usage. The electronic packaging field is rich with various methods and schemes for solder joint reliability prediction. However the success these schemes at predicting useful life varies. Reliability studies of LCC 28's, LCC 68's and LCC 84's using the integrated matrix creep method are presented in this paper.