Design-for-reliability activity for compound-filled leadless-chip-carrier-packaged charge-coupled devices

摘要

Charge-Coupled Devices (CCDs) are expanding into new applications such as digital still cameras and mobile phones. When CCDs were applied in such fields, requirements for robustness against new stress factors were posed on them. The activities of designing in all stages of CCD development, including circuit design, wafer-process development, and production were performed for the new requirements. The resulting reliability and field data show that the compound-filled Leadless-Chip-Carrier (LCC) -packaged CCD offers high reliability. Compound-filled LCC-packaged CCDs can also be soldered by a reflow machine and have an advantageous structure with regard to durability from.