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What kinds of SOI wafers are suitable for what micromachining purposes?

机译:哪种SOI晶圆适合于微加工目的?

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SIMOX (separation by implanted oxygen), ZMR (zone melting recrystallization), and bonded SOI wafers are compared from the viewpoint of applications to sensors and actuators (S&A). These are whole wafers scale SOIs. Other local SOI technologies are discussed. It is noted that SOI wafers are especially attractive for smart power S&A, as each component is dielectrically isolated. Mobile elements such as diaphragm, cantilever, bridge, rotor, and valve can be fabricated by single-crystal silicon.
机译:从应用于传感器和执行器(S&A)的角度比较了SIMOX(通过注入的氧气进行分离),ZMR(区域熔融重结晶)和键合的SOI晶圆。这些是整个晶圆级SOI。讨论了其他本地SOI技术。值得注意的是,SOI晶片对于智能电源S&A尤其有吸引力,因为每个组件都是绝缘的。隔膜,悬臂,桥,转子和阀门等活动元件可以由单晶硅制成。

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