HIGH PIN COUNT POWER PACKAGE FOR HIGH CURRENT, HIGH TEMPERATURE AUTOMOTIVE APPLICATIONS

摘要

New generation of engine management control units and carrnsafety systems (ECU modules) for mechatronicsrnenvironments involve mixed technology system-on-a-chiprn(SOC) fabrication, which seems to be a valid approachrncompared to design partitioned into multiple devices.rnMany automotive applications involve high powerrndissipation (>5 Watts), high operating temperatures (>150rn℃) and medium to high I/O counts (64 –100). This poses arnchallenge for electronic component package design.rnIn this paper, the failure mechanism associated with highrncurrents and high temperatures in plastic packages arerndescribed. A new power surface mount package HiQUAD-rn92 is developed to meet the automotive market requirementsrnpower dissipation and high temperature reliability (up torn180℃). Thermal management, current management andrnreliability under high temperature and high current arernpresented.