New Process for Advanced Packages(PBGA, CBGA, CSP and New MLF, LLP, LGA)

摘要

1. Advanced Packages Require a New Rework 2. New Style Packages LLP Leadless Lead Frame Package 3. Only the Rework Process is Changed 4. Rework Process is as Follows 5. Reflow of Packages is the Same as Production Soldering 6. Cooling Considerations