Improving SMT Yield with AOI and AXI Test Results Analysis

摘要

As printed circuit board assembly (PCBA) becomes more complex, Automatic Optical Inspection (AOI) and Automatic X-ray Inspection (AXI) systems are becoming more widely used in electronics manufacturing. AXI has good defect detection capabilities, but its TaKT time becomes a concern when compared to other machines (screen printer, pick-and-place, reflow, and wave soldering) on the SMT line. How can these two testing machines be used effectively to test production? This translates into: (1) how can we reduce AXI test time by supplementing it with AOI? And (2) how can we use the AOI and AXI test results to improve the overall manufacturing process and thereby increase production yields? Some studies were reported in the past with only AXI. We have been doing this project with AOI and AXI test data analysis to improve assembly test yields.